Our working group and committee members make Bluetooth technology the best it can be.
Working groups have been the driving force behind Bluetooth® technology, delivering innovations that help make the Internet of Things (IoT) a reality.
Every year, the Bluetooth Special Interest Group (SIG) celebrates the hard work and commitment of working groups, committee members, and contributors who have been recognized by their peers as making a difference in advancing Bluetooth technology. Thank you to the winners, and to all of our working group and committee members, for their dedication and contribution this year.
Leadership Award
Jeff Solum
Starkey Hearing Technologies
Hearing Aid Working Group
Jeff Solum currently serves as Chair of the Hearing Aid Working Group. Prior to 2024, Jeff served as Vice Chair of the Hearing Aid Working Group since its inception. Jeff was the co-author of the LE Isochronous Channels feature. He was also the lead author of the LE Connection Subrating feature. Jeff co-authored the Periodic Advertising Synchronization Transfer feature that allows assistant devices to direct audio devices to find broadcasts. Jeff was a key contributor to many of the Generic Audio profiles and services. Jeff’s membership includes the Hearing Aid Working Group, Generic Audio Working Group, Core Specification Working Group, and the Bluetooth Architectural Review Board.
Finalists
|
Szymon Slupik |
Shirin Ebrahimi-Taghizadeh, PhD |
Innovator of the Year Award
Chris White
Dolby Laboratories, Inc.
Audio, Telephony, and Automotive Working Group
Bio: After playing rock ‘n’ roll full time for a few years, Chris was lucky enough to secure a role at Dolby Laboratories helping customers implement Dolby technology into TVs, A/V receivers, and smartphones. Later, Chris served as the lead Bluetooth® engineer for Dolby’s first-ever consumer product, the Dolby Dimension headphone. He currently serves as Dolby’s sole full-time Bluetooth engineer, focusing on enabling next-generation wireless audio experiences.
Finalists
|
Oren Haggai |
Erik Anderlind |
Jeff Solum |
Outstanding Technical Contributor Award
Asbjørn Sæbø
Nordic Semiconductor ASA
Hearing Aid Working Group
Bio: Asbjørn Sæbø has been working with Bluetooth® Low Energy at Nordic Semiconductor since 2006, starting with what became Bluetooth Low Energy. For many years, Asbjørn led the development of Nordic’s Bluetooth Low Energy stack. Currently, he leads Nordic’s Bluetooth LE Audio work. At the Bluetooth SIG, he participates in the Generic Audio, Hearing Aid, and Audio, Telephony, and Automotive Working Groups but has also contributed to other groups.
Finalist
Piotr Winiarczyk
Silvair, Inc.
Special Recognition for Outstanding Leadership in BARB
Leif-Alexandre Aschehoug
Nordic Semiconductor ASA
Bio: Leif-Alexandre Aschehoug is a principal R&D engineer within Nordic Semiconductor’s software department based in Trondheim, Norway. Leif has been a valued contributor to the Medical Devices Working Group and Sports and Fitness Working Group. Leif was the Medical Devices Working Group Chair and then the Sports and Fitness Working Group Chair before becoming Nordic’s councilor in the Bluetooth Architectural Review Board (BARB). He has been the BARB Chair since 2020. Leif joined Nordic Semiconductor in 2008 after working for nine years in France and has been working as a software developer and project leader. Outside of work, Leif is a private pilot and enjoys the mountains in all seasons, on foot, by bike, and on any type of skis.
Special Recognition for Outstanding Contribution to the Qualification Process Improvements and QPRD
Alicia Courtney
Broadcom Corporation
Bio: An R&D SW Quality Engineer at Broadcom, Alicia is the Chair of the Bluetooth Qualification Review Board (BQRB) and Vice Chair of both the Bluetooth Test and Interoperability (BTI) Committee and the Alignment and Process Improvement Committee (APIC). The most significant contributions of the last 12 months include qualification and testing updates due to Qualification Program Reference Document (QPRD) v3 as well as Bluetooth Core Specification v6.0.
Outstanding IOP Contributor Appreciation Award
Intel Corporation
Audio, Telephony, and Automotive Working Group
The team from Intel Corporation— Vlad Tsigan, Chethan Tumkur Narayan, and Luiz Von Dentz —is recognized for their outstanding contributions towards the validation of the Gaming Audio Profile Specification. The team developed prototype testing to significantly increase coverage of simultaneously rendered and captured gaming settings and support for full-band microphone capture coverage in higher quality and lower latency.
Infineon Technologies AG
Automation Working Group
Victor Zhodzishsky from Infineon Technologies AG is recognized for his outstanding contributions towards the validation of the Industrial Measurement Devices Profile and Service Specifications.
Broadcom Corporation
Core Specification Working Group
The team from Broadcom Corporation— Shawn Ding, Irene Fan, Shanshan Jiang, Sean Lin, Yunkai Qian, Balakumar Ramalingam, Wen-Hsin Wang, and Lewis Weng—is recognized for their outstanding contributions towards the validation of the Core Specification 6.0 enhancements including Channel Sounding, Decision Based Advertising Filtering, Enhancements for ISOAL, Frame Space Update, LL Extended feature set, having contributed more than 25 percent of the results entered.
Google LLC
Hearing Aid Working Group
The team from Google LLC— Benson Li, Jack He, and Rongxuan Liu—is recognized for their outstanding contributions towards the validation of the Broadcast Audio Uniform Resource Identifier Specification, having contributed more than 37 percent of the results entered.
Special Recognition for Channel Sounding Remote IOP Testing
| Fabien Duvoux Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
Tim Newton RF Creations |
Peter Ford RF Creations |
Special Recognition for Channel Sounding IOP Support
| Qi Jiang Google LLC |
Shawn Ding Broadcom Corporation |
Angel Polo Broadcom Corporation |
Bluetooth SIG appreciation – Recognition of IOP Participation
Core Specification 6.0 Enhancements
Channel Sounding
| Yann Ly-Gagnon Apple Inc. |
Roman Chernobelsky Apple Inc. |
David Levy Apple Inc. |
Ido Gross Apple Inc. |
Tomer Hershkovitz Apple Inc. |
Balakumar Ramalingam Broadcom Corporation |
| Irene Fan Broadcom Corporation |
Lewis Weng Broadcom Corporation |
Sean Lin Broadcom Corporation |
Shanshan Jiang Broadcom Corporation |
Shawn Ding Broadcom Corporation |
Wen-Hsin Wang Broadcom Corporation |
| Yunkai Qian Broadcom Corporation |
Fabien DUVOUX Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
Qi Jiang Google LLC |
Joe Chang Litepoint |
| Qiang Fu Litepoint |
Tushar Patel Litepoint |
Alexandre Dauphinais Nordic Semiconductor ASA |
Ivan Iushkov Nordic Semiconductor ASA |
Erik Semb Omre Nordic Semiconductor ASA |
Thomas Johansen Nordic Semiconductor ASA |
| Erik Sandgren Nordic Semiconductor ASA |
Ryan Chu Nordic Semiconductor ASA |
Pascal Bernard NXP B.V. |
James Zhang NXP B.V. |
Endy Qin NXP B.V. |
Mihai-Ionut Stanciu NXP B.V. |
| Luc Revardel NXP B.V. |
Wenbo Qi NXP B.V. |
Olivier Jean NXP B.V. |
Santiago Garcia NXP B.V. |
John Vandermeer NXP B.V. |
Khurram Waheed NXP B.V. |
| Jerome Brillant NXP B.V. |
Hassan Elmadi Packetcraft, Inc. |
Ram Mohan Korukonda Qualcomm Technologies, Inc. |
Mayank Batra Qualcomm Technologies, Inc. |
Rachelle Chen Qualcomm Technologies, Inc. |
Chris Holbrow Qualcomm Technologies, Inc. |
| Mohit Maheshwari Qualcomm Technologies, Inc. |
Naveen Kumar Reddy Kanakanti Qualcomm Technologies, Inc. |
Tim Newton RF Creations |
Peter Ford RF Creations |
Kenton Payne Rohde & Schwarz Services Ltd |
Trine Jensen Samsung Electronics Co., Ltd. |
| Sune Timm Simonsen Samsung Electronics Co., Ltd. |
Allan Madsen Samsung Electronics Co., Ltd. |
Lauri Hintsala Silicon Laboratories |
Wesam Koraim Silicon Laboratories |
Karim Mokhtar Synopsys, Inc. |
Ahmed Ismail Synopsys, Inc. |
| Priyanka Gupta Teledyne Lecroy, Inc. |
Rishu Kumar Teledyne Lecroy, Inc. |
Varun Gopalan Teledyne Lecroy, Inc. |
Yuexin Liu Telink Semiconductor (Shanghai) Co., Ltd |
Sihui Wang Telink Semiconductor (Shanghai) Co., Ltd |
Fan Qinghua Telink Semiconductor (Shanghai) Co., Ltd |
| Jan Slupski Telink Semiconductor (Shanghai) Co., Ltd |
Decision Based Advertising Filtering
| Shanshan Jiang Broadcom Corporation |
Shawn Ding Broadcom Corporation |
Fabien DUVOUX Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
Joseph Robert LTIMINDTREE LIMITED |
| Wenbo Qi NXP B.V. |
Enhancements for ISOAL
| Shanshan Jiang Broadcom Corporation |
Shawn Ding Broadcom Corporation |
Fabien DUVOUX Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
Thorkild Pedersen GN Hearing A/S |
| ChaoYang Wu Infineon Technologies AG |
Vishal Dhull Intel Corporation |
Joseph Robert LTIMINDTREE LIMITED |
Sam Geeraerts NXP B.V. |
Raoul Grenier NXP B.V. |
Frame Space Update
| Sean Lin Broadcom Corporation |
Shawn Ding Broadcom Corporation |
Fabien DUVOUX Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
Joseph Robert LTIMINDTREE LIMITED |
| Johan Stridkvist Nordic Semiconductor ASA |
Erik Sandgren Nordic Semiconductor ASA |
Antonios Prodromakis Renesas |
Mesh Davaraj Renesas |
Theodora Dimitropoulou Renesas |
Frederik Jensen Samsung Electronics Co., Ltd. |
| Marcus Jensen Samsung Electronics Co., Ltd. |
Søren Andersen Samsung Electronics Co., Ltd. |
Karim Mokhtar Synopsys, Inc. |
Ahmed Ismail Synopsys, Inc. |
LL Extended Feature Set
| Sean Lin Broadcom Corporation |
Shanshan Jiang Broadcom Corporation |
Shawn Ding Broadcom Corporation |
Fabien DUVOUX Ellisys |
Kyle Penri-Williams Ellisys |
Clement Vacheron Ellisys |
| Joseph Robert LTIMINDTREE LIMITED |
Johan Stridkvist Nordic Semiconductor ASA |
Frederik Jensen Samsung Electronics Co., Ltd. |
Marcus Jensen Samsung Electronics Co., Ltd. |
Søren Andersen Samsung Electronics Co., Ltd. |
Gaming Audio Profile
| Vlad Tsigan Intel |
Chethan Tumkur Narayan Intel |
Luiz Von Dentz Intel |
Nidhi Sakaleshpur Venkatesh LTIMindTree Limited |
Samuel Paveza Microsoft Corporation |
Emil Gydesen Nordic Semiconductor ASA |
| Didier Lauwerys NXP B.V. |
Peter Ford RF Creations |
Anish Singh Qualcomm Technologies, Inc. |
Parameshwar Kengond Qualcomm Technologies, Inc. |
Sushil Deka Qualcomm Technologies, Inc. |
Tarun Goswami Qualcomm Technologies, Inc. |
| Ryo Takai Sony Group Corporation |
Hiroki Makino Sony Group Corporation |
Broadcast Audio URI
| Thorkild Pedersen GN Hearing A/S |
Benson Li Google LLC |
Jack He Google LLC |
Rongxuan Liu Google LLC |
Peter Ford RF Creations |
Mats Lennartsson Sony Group Corporation |
| Viswanth Bhagavatula Sony Group Corporation |
Industrial Measurment Devices Profile and Service
| Franz Springer Hoffmann SE |
Victor Zhodzishsky Infineon Technologies AG |
Past Winners
2023
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Wei Li | Nordic Semiconductor ASA | Outstanding New Technical Contributor | Core Specification Working Group |
| Łukasz Rymanowski | Codecoup | Outstanding New Technical Contributor | Generic Audio Working Group |
| Andrew Estrada | Sony Electronics | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group (ATAWG) |
| Chris White | Dolby Laboratories, Inc. | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group (ATAWG) |
| Robin Heydon | Qualcomm Technologies, Inc. | Outstanding Technical Contributor | Electronic Shelf Label Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Omkar Kulkarni | Nordic Semiconductor ASA | Outstanding Technical Contributor | Mesh Working Group |
| Alicia Courtney | Broadcom Corporation | Bluetooth SIG Appreciation Award | Bluetooth Qualification Review Board |
| Timothy Cook Cheng Jiang Ryan McCord Matthew Seabold Chenhong Zhou |
Qualcomm Technologies, Inc. | Outstanding IOP Contributor Appreciation Award | Electronic Shelf Label Working Group |
| Ash Chen Marie Janssen Dayeong Lee Benson Li Christopher Rabasa Christian Rollmann Jeremy Wu |
Google LLC | Outstanding IOP Contributor Appreciation Award | Audio, Telephony, and Automotive Working Group |
| Erik Moll Abdul Nabi |
Koninklijke Philips N.V. | Outstanding IOP Contributor Appreciation Award | Medical Devices Working Group |
| Lauri Hintsala Lasse Huovinen Karoly Kovacs |
Silicon Laboratories | Outstanding IOP Contributor Appreciation Award | Core Specification Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding IOP Contributor Appreciation Award | Mesh Working Group |
Board of Directors Recognition Award for Outstanding Contribution
| Recipient Name | Category | Group |
|---|---|---|
| Leif Aschehoug | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Asbjørn Sæbø | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Jonathan Tanner | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Mayank Batra | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Simon Slupik | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Marcel Holtmann | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Robert Hughes | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Robert Hulvey | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Omkar Kulkarni | Board of Directors Recognition Award | Remote Testing Task Force (RTTF) |
| Robin Heydon | Board of Directors Recognition Award | Specification Automation Task Force (SATF) |
| Piotr Winiarczyk | Board of Directors Recognition Award | Specification Automation Task Force (SATF) |
Bluetooth SIG appreciation – Recognition of IOP Participation
| Name | Member Company | Specification |
|---|---|---|
| Chi Kwan | Broadcom Corporation | Core Specification Enhancements – EAD & PAwR |
| Sean Lin | Broadcom Corporation | Core Specification Enhancements – EAD & PAwR |
| Timothy Cook | Qualcomm Technologies, Inc. | Core Specification Enhancements – EAD & PAwR |
| Karoly Kovacs | Silicon Laboratories | Core Specification Enhancements – EAD & PAwR |
| Lasse Huovinen | Silicon Laboratories | Core Specification Enhancements – EAD & PAwR |
| Lauri Hintsala | Silicon Laboratories | Core Specification Enhancements – EAD & PAwR |
| Kyle Penri-William | Ellisys | Core Specification Enhancements – EAD & PAwR |
| Fabien Duvoux | Ellisys | Core Specification Enhancements – EAD & PAwR |
| Clement Vacheron | Ellisys | Core Specification Enhancements – EAD & PAwR |
| Rangineni Balasubramanyam | Infineon Technologies AG | Core Specification Enhancements – EAD & PAwR |
| Yu Chia Lin | Infineon Technologies AG | Core Specification Enhancements – EAD & PAwR |
| Hassan Elmadi | Packetcraft, Inc. | Core Specification Enhancements – EAD & PAwR |
| Matthew Seabold | Qualcomm Technologies, Inc. | Core Specification Enhancements – EAD & PAwR |
| Priyanka Gupta | Teledyne | Core Specification Enhancements – EAD & PAwR |
| Dan James | Teledyne | Core Specification Enhancements – EAD & PAwR |
| Craig Carlson | F. Hoffmann-La Roche AG | Elapsed Time Service |
| Abdul Nabi | Koninklijke Philips N.V. | Elapsed Time Service |
| Erik Moll | Koninklijke Philips N.V. | Elapsed Time Service |
| Leif Aschehoug | Nordic Semiconductor ASA | Elapsed Time Service |
| Pirun Lee | Nordic Semiconductor ASA | Electronic Shelf Label Profile & Service |
| Timothy Cook | Qualcomm Technologies, Inc. | Electronic Shelf Label Profile & Service |
| Matthew Seabold | Qualcomm Technologies, Inc. | Electronic Shelf Label Profile & Service |
| Cheng Jiang | Qualcomm Technologies, Inc. | Electronic Shelf Label Profile & Service |
| Ryan McCord | Qualcomm Technologies, Inc | Electronic Shelf Label Profile & Service |
| Chenhong Zhou | Qualcomm Technologies, Inc. | Electronic Shelf Label Profile & Service |
| Karoly Kovacs | Silicon Laboratories | Electronic Shelf Label Profile & Service |
| Tamas Kranicz | Silicon Laboratories | Electronic Shelf Label Profile & Service |
| Craig Carlson | F. Hoffmann-La Roche AG | Generic Health Sensor Profile & Service |
| Abdul Nabi | Koninklijke Philips N.V. | Generic Health Sensor Profile & Service |
| Erik Moll | Koninklijke Philips N.V. | Generic Health Sensor Profile & Service |
| Ella Chu | Microchip Technology Incorporated | Generic Health Sensor Profile & Service |
| Charlie Lee | Microchip Technology Incorporated | Generic Health Sensor Profile & Service |
| Leif Aschehoug | Nordic Semiconductor ASA | Generic Health Sensor Profile & Service |
| Tabish Rizvi | Apple Inc. | HFP Enhancement – Super Wide Band |
| Sherry Smith | Broadcom Corporation | HFP Enhancement – Super Wide Band |
| David Hughes | Broadcom Corporation | HFP Enhancement – Super Wide Band |
| Ash Chen | Google LLC | HFP Enhancement – Super Wide Band |
| Benson Li | Google LLC | HFP Enhancement – Super Wide Band |
| Christian Rollmann | Google LLC | HFP Enhancement – Super Wide Band |
| Christopher Rabasa | Google LLC | HFP Enhancement – Super Wide Band |
| Jeremy Wu | Google LLC | HFP Enhancement – Super Wide Band |
| Marie Janssen | Google LLC | HFP Enhancement – Super Wide Band |
| Dayeong Lee | Google LLC | HFP Enhancement – Super Wide Band |
| Anil Kumar Vutukuru | LTIMindtree | HFP Enhancement – Super Wide Band |
| Amit Panvekar | Qualcomm Technologies, Inc. | HFP Enhancement – Super Wide Band |
| Omkar Kulkarni | Nordic Semiconductor ASA | Mesh NLC Profiles |
| Piotr Winiarczyk | Silvair, Inc. | Mesh NLC Profiles |
2022
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Koorosh Akhavan | Qualcomm Technologies, Inc. | Outstanding New Technical Contributor | Core Specification Working Group |
| Christof Fersch | Dolby | Outstanding New Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Frank Berntsen | Nordic Semiconductor ASA | Outstanding Technical Contributor | Human Interface Device Working Group |
| Masahiko Seki | Sony Corporation | Outstanding Technical Contributor | Generic Audio Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Clive Feather | Samsung | Outstanding Technical Contributor | Core Specification Working Group |
| Nick Hunn | WiFore Consulting | Bluetooth SIG Appreciation Award | Hearing Aid Working Group |
| Yao Wang | Barrot Technology Limited | Outstanding IOP Contributor Appreciation Award | Audio, Telephony, and Automotive Working Group |
| The Telink Mesh Team | Telink Semiconductor (Shanghai) Co., Ltd | Outstanding IOP Contributor Appreciation Award | Mesh Working Group |
| Grzegorz Kolodziejczyk, Mariusz Skamra, Jakub Tyszkowski, Łukasz Rymanowski | Codecoup | Outstanding IOP Contributor Appreciation Award | Hearing Aid Working Group |
| Sushil Deka, Shitiz Kumar, Prashant Agrawal, Parameshwar Kengond, Harish Kumar S, Tarun Goswami, Lucrezia Fanizzi, Pascal Chapelot, Stratos Chatzikyriakos, Mohammed Saleem Khan, Anantha Krishna | Qualcomm Technologies, Inc. | Outstanding IOP Contributor Appreciation Award | Generic Audio Working Group |
| Christian-Alexander Luszick, Craig Carlson, David Sempsrott, Rick Wilson, and Robert Sabo | F. Hoffmann-La Roche AG | Outstanding IOP Contributor Appreciation Award | Medical Devices Working Group |
| Frank Berntsen | Nordic Semiconductor ASA | Outstanding IOP Contributor Appreciation Award | Human Interface Device Working Group |
Bluetooth SIG appreciation – Recognition of IOP Participation
| Name | Member Company | Specification |
|---|---|---|
| Christian-BT Luszick | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Christoph Fischer | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Craig Carlson | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| David Sempsrott | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Rick Wilson | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Robert Sabo | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Gerrit Niezen | Tidepool Project | Authorization Control Profile and Service |
| Nathaniel Hamming | Tidepool Project | Authorization Control Profile and Service |
| Tapani Otala | Tidepool Project | Authorization Control Profile and Service |
| Yao Wang | Barrot Technology Limited | Basic Audio Profile |
| Chaojing Sun | Broadcom Corporation | Basic Audio Profile |
| Sherry Smith | Broadcom Corporation | Basic Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Basic Audio Profile |
| Mariusz Skamra | Codecoup sp. z o.o. | Basic Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Basic Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Basic Audio Profile |
| Sreeram Tatapudi | Infineon Technologies AG | Basic Audio Profile |
| Sahana DN | Infineon Technologies AG | Basic Audio Profile |
| Hardikkumar Chauhan | Infineon Technologies AG | Basic Audio Profile |
| Luiz Von Dentz | Intel Corporation | Basic Audio Profile |
| Ella Chu | Microchip Technology Incorporated | Basic Audio Profile |
| Charlie Lee | Microchip Technology Incorporated | Basic Audio Profile |
| Nidhi S Venkatesh | MindTree Limited | Basic Audio Profile |
| Badrinarayanan K | MindTree Limited | Basic Audio Profile |
| Anil Vutukuru | MindTree Limited | Basic Audio Profile |
| Harish Kumar S | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Hendrik Cordier | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Nagendra V | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Pascal Chapelot | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Prashant Agrawal | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Sushil Deka | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Vasilis Michopoulos | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Inga Stotland | Intel Corporation | Battery Service 1.1 |
| Frank Berntsen | Nordic Semiconductor ASA | Battery Service 1.1 |
| Yao Wang | Barrot Technology Limited | Common Audio Profile |
| Sherry Smith | Broadcom Corporation | Common Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Common Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Common Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Common Audio Profile |
| Hardikkumar Chauhan | Infineon Technologies AG | Common Audio Profile |
| Nidhi S Venkatesh | MindTree Limited | Common Audio Profile |
| Badrinarayanan K | MindTree Limited | Common Audio Profile |
| Anil Vutukuru | MindTree Limited | Common Audio Profile |
| Harish Kumar S | Qualcomm Technologies, Inc. | Common Audio Profile |
| Yao Wang | Barrot Technology Limited | Hearing Access Profile and Service |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Mariusz Skamra | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Thorkild Pedersen | GN Hearing A/S | Hearing Access Profile and Service |
| Oktay Baris | GN Hearing A/S | Hearing Access Profile and Service |
| Naveen M N | Hearing Access Profile and Service | |
| Yao Wang | Barrot Technology Limited | Public Broadcast Profile |
| Sherry Smith | Broadcom Corporation | Public Broadcast Profile |
| Laurent Trarieux | CEVA-Riveriawaves | Public Broadcast Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Public Broadcast Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Public Broadcast Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Public Broadcast Profile |
| Thorkild Pedersen | GN Hearing A/S | Public Broadcast Profile |
| Yao Wang | Barrot Technology Limited | Telephony and Media Audio Profile |
| Sherry Smith | Broadcom Corporation | Telephony and Media Audio Profile |
| Laurent Trarieux | CEVA-Riveriawaves | Telephony and Media Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Efstratios Chatzikyriakos | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Parameshwar Kengond | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Prashant Agrawal | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Sushil Deka | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Michal Narajowski | Codecoup sp. z o.o. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Espressif Systems (Shanghai) Co., Ltd. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
|
| Mike Weng | Infineon Technologies AG | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Badrinarayanan K | MindTree Limited | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Peter Kozar | Silicon Laboratories | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Piotr Winiarczyk | Silvair, Inc. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Telink Semiconductor (Shanghai) Co., Ltd | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
2021
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Sophia Feil | Expleo Germany GmbH | Outstanding New Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Qing An | Alibaba Group | Outstanding New Technical Contributor | Mesh Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Chris Church | Qualcomm | Outstanding Technical Contributor | Generic Audio Working Group |
| Angel Polo | Broadcom Incorporated | Outstanding Technical Contributor | Core Specification Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Szymon Slupik | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Alicia Courtney | Broadcom | Bluetooth SIG appreciation – Working Group Contributor | BTI & BQRB Working Group |
2020
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Pouria Zand | Cypress Semiconductor Corporation | Outstanding New Technical Contributor | Core Specification Working Group |
| Piergiuseppe Di Marco | Silvair, Inc. | Outstanding New Technical Contributor | Mesh Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor of the Year | Audio, Telephony, and Automotive Working Group |
| Jori Rintahaka | Silicon Laboratories | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Tomas Motos | Texas Instruments Incorporated | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Chris Church | Qualcomm | Outstanding Technical Contributor of the Year | Generic Audio Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Asbjørn Saebø | Nordic Semiconductor ASA | Bluetooth SIG appreciation – Working Group Contributor | Generic Audio Working Group |
2019
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mayank Batra | Qualcomm Technologies, Inc. | Working Group/Committee Chair of the Year | Core Specification Working Group |
| Szymon Slupik | Silvair, Inc. | Working Group/Committee Chair of the Year | Mesh Working Group |
| Mesh Working Group | n/a | Working Group of the Year | Mesh Working Group |
| Danilo Blasi | STMicroelectronics | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Kanji Kerai | Sivantos GmbH | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Ravi Bamidi | Silvair, Inc. | Outstanding New Contributor in Bluetooth SIG Groups | Mesh Working Group |
| Robert Hughes | Intel Corporation | Chairman’s Award | n/a |
2018
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mayank Batra | Qualcomm | Working Group/Committee Chair of the Year | Core Specification Working Group |
| Mesh Working Group | n/a | Working Group of the Year Award | Mesh Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor of the Year Award | Mesh Working Group |
| Himanshu Bhalla | Intel Corporation | Outstanding New Contributor to Bluetooth SIG Groups | Generic Audio Working Group |
| Felix Bootz | F. Hoffmann-La Roche AG | Key Contributor to Reconnection Configuration Profile and Service | Medical Devices Working Group |
| Harald Prinzhorn | F. Hoffmann-La Roche AG | Key Contributor to Insulin Delivery Profile and Service | Medical Devices Working Group |
2017
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Brian Redding | Qualcomm | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
| Clive Feather | Samsung Electronics Co., Ltd. | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7, For Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Errata Service Release 10 | Core Specification Working Group |
| Gerard Harbers | Xicato Inc. | Outstanding New Contributor in Bluetooth SIG Groups and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 | Mesh Working Group |
| Guillaume Schatz | EM MICROELECTRONIC MARIN SA | For Outstanding Contributions to the Adoption of Fitness Machine Profile and Service | Sports & Fitness Working Group |
| Joel Linsky | Qualcomm | For Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
| Leif-Alexandre Aschehoug | Nordic Semiconductor ASA | For Outstanding Contributions to the Adoption of Fitness Machine Profile and Service and For Outstanding Contributions to the Adoption of GATT Specification Supplement | Sports & Fitness Working Group |
| Michael Ungstrup | Widex A/S | Outstanding New Contributor in Bluetooth SIG Groups | Hearing Aid Working Group |
| Olivia Bellamou-Huet | Assystem | For Outstanding Contributions to the Adoption of Message Access Profile 1.4 | Audio, Telephony, and Automotive Working Group |
| Piotr Winiarczyk | Silvair, Inc. | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0 | Mesh Working Group and Architectural Review Board |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 | Mesh Working Group |
| Robin Heydon | Qualcomm | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 | Mesh Working Group and Architectural Review Board |
| Szymon Slupik | Silvair, Inc. | Working Group/Committee Chair of the Year, Working Group of the Year Award, Outstanding Technical Contributor of the Year Award and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0 | Mesh Working Group |
| Tomas Motos | Texas Instruments Incorporated | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
2016
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mesh Working Group (Szymon and Bob) | Working Group of the Year | Mesh Working Group | |
| Robert Hughes | Intel Corporation | Working Group/Committee Chair of the Year | Mesh Working Group |
| Brian Redding | Qualcomm | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Szymon Slupik | Seed Labs Inc. | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Olivia Bellamou-Huet | Berner & Mattner Systemtechnik GmbH | Outstanding New Contributor in Bluetooth SIG Groups | Audio, Telephony and Automotive & Sports and Fitness Working Groups |
| Sam Geeraerts | NXP Semiconductors | Outstanding New Contributor in Bluetooth SIG Groups | Core Specification Working Group |
| Joel Linsky | Qualcomm | For Outstanding Contributions to the Adoption of Core Specification Addendum 5 | Core Specification Working Group |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Jingu Choi | LG Electronics Inc. | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Chris Church | Qualcomm | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Casper Bonde | Samsung Electronics Co., Ltd. | For Outstanding Contributions to the Adoption of Message Access Profile 1.3 | Audio, Telephony and Automotive Working Group |
| Dominik Sollfrank | Berner & Mattner Systemtechnik GmbH | For Outstanding Contributions to the Adoption of Message Access Profile 1.3 | Audio, Telephony and Automotive Working Group |
| Guillaume Schatz | Polar Electro Oy | For Outstanding Contributions to the Adoption of Cycling Power Profile & Service 1.1 | Sports and Fitness Working Group |
| Laurence Richardson | Qualcomm | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Guillaume Schatz | Polar Electro Oy | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Leif-Alexandre Aschehoug | Nordic Semiconductor ASA | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
