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Read the latest press releases about Bluetooth wireless technology from the Bluetooth SIG.
BLUETOOTH SIG AND MCPC FORGE STRONGER TIES
04-Jun-2008
Bluetooth SIG
Groups Sign Memorandum Of Understanding Outlining Significant Cooperative Efforts
TOKYO, JAPAN – June 4, 2008 – The Bluetooth Special Interest Group (SIG) and Japan’s Mobile Computing Promotion Consortium (MCPC) today announced the establishment of formal ties and cooperation between the two organizations with the signing of a Memorandum of Understanding (MoU) which outlines the details of their expanded working relationship. The two organizations have long shared the goal of continuing the success of Bluetooth wireless technology worldwide and increasing the understanding and adoption of Bluetooth wireless technology in the Japanese market.
“MCPC has been a key partner to the Bluetooth SIG for many years – but this MoU officially recognizes their importance and adds a specific role for MCPC in the specification development process, “ said Mike Foley, Ph.D., executive director, the Bluetooth SIG. “This is the first time we’ve ever included a third-party organization in the formal specification development/review process – as such, it is a very significant step and one that I think signifies the importance of MCPC and the Japanese market to the Bluetooth SIG.”
MCPC, which has a dedicated Bluetooth technology Committee and three distinct Bluetooth technology working groups, has worked for years to establish best practices for Bluetooth implementation in Japanese products and products exported by Japanese manufacturers. With established Bluetooth interoperability testing events and the development of technical reference documents, MCPC has a long history of leadership within the Bluetooth industry. The MoU provides a formal role for MCPC in the specification review process – bringing additional Japanese expertise into the process and ultimately improving the specifications.
“The Bluetooth SIG and MCPC share the same goal for Bluetooth – that it should be the most pervasive short-range wireless technology, enabling innovativemobile computing solutions in Japan and the world.” Said Masahiro Hataguchi, Secretary General, MCPC. “Working more closely on specification development and interoperability testing, we can accomplish that goal in Japan.”
Members of both organizations will be hard at work in coming months as the Bluetooth technology roadmap takes the form of two new specifications due for release in 2009. Bluetooth low energy technology and Bluetooth high speed technology are currently in development.
The MoU, signed by both Dr. Foley and Mr. Hataguchi at a signing ceremony at the Bluetooth SIG’s Asia-Pacific headquarters in Hong Kong, China.
About Bluetooth® Wireless Technology
Bluetooth wireless technology is the global short-range wireless standard for personal connectivity of a broad range of electronic devices. The technology is now available in its fourth version of the core specification and continues to develop, building on its inherent strengths – small-form factor radio, low power, low cost, built-in security, robustness, ease-of-use, and ad hoc networking abilities. More than five new Bluetooth enabled products are qualified every working day and 13 million Bluetooth units are shipping per week. The installed base of Bluetooth devices is one and a half nearly two billion and climbing, making it the only proven wireless technology choice for developers, product manufacturers, and consumers worldwide. About the Bluetooth SIG
The Bluetooth Special Interest Group (SIG), comprised of leaders in the telecommunications, computing, consumer electronics, automotive and network industries, is driving development of Bluetooth wireless technology and bringing it to market. The Bluetooth SIG includes Promoter group companies Ericsson, Intel, Lenovo, Microsoft, Motorola, Nokia and Toshiba, along with over 10,000 Associate and Adopter member companies. The Bluetooth SIG, Inc. headquarters are located in Bellevue, Washington, U.S.A. For more information please visit www.bluetooth.com. The Bluetooth word mark and logo are registered trademarks and are owned by the Bluetooth SIG, Inc. Note to Editors: Media assets (stills and video) to accompany stories about Bluetooth wireless technology are available on Bluetooth.com, hosted by The NewsMarket: http://www.thenewsmarket.com/Bluetooth/br/Story/MultimediaPressPacks.aspx Press Contacts:
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